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RM807
Power Amplifier Module for TDMA PCS (1850-1910 MHz)
The RM807 Power Amplifier Module (PAM) for Personal Communications Service (PCS) is a fully matched 6-pin surface mount module developed for PCS and wireless local loop applications. This small and efficient power amplifier packs a full 1850-1910 MHz bandwidth coverage into a single compact package. This device meets the stringent spectral linearity requirements of Time Division Multiple Access (TDMA) PCS transmission with high power added efficiency to output power of 29.5 dBm. A single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains onboard bias circuitry as well as input and interstage matching circuits. The output match is realized off-chip within the module package to optimize efficiency and power performance into a 50 ohm load. This device is manufactured with Skyworks' GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the RM807 can be supplied directly from a three-cell nickel cadmium, single cell lithium ion, or other suitable battery with output in the 3-4 volts range. Power down is accomplished by setting the voltage on the low current reference pin to zero volts. No external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage supplied from the battery.
Distinguishing Features
* * * * * * Low voltage positive bias supply Good linearity High efficiency Large dynamic range 6-pin LCC package (6 x 6 x 1.5 mm) Power down control
Applications
* * Personal Communications Services (TDMA) Wireless Local Loop (WLL)
Functional Block Diagram
VREF (3) VCC1 (1) VCC2 (4)
Driver Stage Bias
Power Stage Bias
RF Input (2)
Input Match
DA
Inter Stage Match
PA
Output Match
RF Output (5)
MMIC
MODULE
(6, 7) GND
(6, 7) GND
Data Sheet (c) 2001, Skyworks Solutions, Inc., All Rights Reserved.
100409F February 7, 2002
Electrical Specifications
RM807
Power Amplifier Module for TDMA PCS (1850-1910 MHz)
Electrical Specifications
The following tables list the electrical characteristics for the RM807 Power Amplifier. Table 1 lists the absolute maximum rating for continuous operation. Table 2 lists the recommended operating conditions for achieving the electrical performance listed in Table 3, which contains the electrical performance data of the RM807 Power Amplifier under recommended operating conditions.
Table 1. Absolute Maximum Ratings(1) Parameter
RF Input Power Supply Voltage Reference Voltage Case Operating Temperature Storage Temperature
NOTE(S):
(1)
Symbol
Pin Vcc Vref Tc Tstg
Minimum
-- -- -- -30 -55
Nominal
3.0 3.5 3.1 +25 --
Maximum
8.0 5.0(2) 3.3 +110 +125
Unit
dBm Volts Volts C C
No damage assuming only one parameter is set at limit at a time with all other parameters set at or below nominal value. (2) Under pulsed TDMA modulated mode, operation at maximum supply voltage of 6.2 V up to 100 ms.
Table 2. Recommended Operating Conditions Parameter
Supply Voltage Reference Voltage Operating Frequency Operating Temperature
Symbol
Vcc Vref Fo To
Minimum
3.0 3.0 1850 -30
Nominal
3.5 3.1 1880 +25
Maximum
4.2 3.3 1910 +85
Unit
Volts Volts MHz C
2
Skyworks
100409F February 7, 2002
RM807
Power Amplifier Module for TDMA PCS (1850-1910 MHz)
Table 3. Electrical Specifications for TDMA/PCS Nominal Operating Conditions(1) Characteristic
Quiescent current Reference current Leakage current Gain Power Added Efficiency Adjacent Channel Power -30 kHz offset -60 kHz offset -90 kHz offset Harmonics Second Third PA "Turn off time" PA "Turn on time" Noise Power in RX band 1930 - 1990 MHz(2) Noise Figure Input Voltage Standing Wave Ratio Stability (spurious output) Ruggedness--no damage
NOTE(S):
(1) (2)
Electrical Specifications
Condition
-- -- PA off Po = 0 dBm Po = 29.5 dBm -- Po 29.5 dBm Po 29.5 dBm Po 29.5 dBm Po 29.5 dBm Po 29.5 dBm -- -- Po 29.5 dBm -- -- 5:1 VSWR all phases Po 29.5 dBm
Symbol
Iq Iref
Minimum
-- -- --
Typical
120.0 2.0 4.5 30.0 29.0 37.0
Maximum
140.0 3.0 25.0 31.5 31.5 --
Unit
mA mA A dB dB %
G Gp PAED
26.0 26.0 32.0
ACP1 ACP2 ACP3
-- -- --
-30.0 -51.0 -55.0
-28.5 -47.0 --
dBc dBc dBc
DFo2 DFo3 -- -- Np NF VSWR S Ru
-- -- -- -- -- -- -- -- --
-49.0 -60.0 10.0 10.0 -136.5 6.0 1.5:1 -- --
-- -- -- -- -136.0 -- 1.8:1 -60.0 10:1
dBc dBc S S dBm/Hz dB -- dBc VSWR
TDMA MODE, Vcc = +3.5 V, Vref = +3.1 V, Freq = 1880 MHz, Tc = +25 C. With NADC modulation applied.
100409F February 7, 2002
Skyworks
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Electrical Specifications
RM807
Power Amplifier Module for TDMA PCS (1850-1910 MHz)
Table 4. Electrical Specifications for TDMA/PCS Recommended Operating Conditions(1) Characteristic
Quiescent current Reference current Leakage Gain Power Added Efficiency Adjacent Channel Power -30 kHz offset -60 kHz offset -90 kHz offset Harmonics Second Third PA "Turn off time" PA "Turn on time" Noise Power in RX band 1930 - 1990 MHz(2) Input Voltage Standing Wave Ratio Stability (spurious output)(3) Ruggedness--no damage(3)
NOTE(S):
(1) (2)
Condition
-- -- PA off Po = 0 dBm Po = 29.5 dBm -- Po 29.5 dBm Po 29.5 dBm Po 29.5 dBm Po 29.5 dBm Po 29.5 dBm -- -- Po 29.5 dBm -- 5:1 VSWR all phases Po 29.5 dBm
Symbol
Iq Iref
Minimum
-- -- --
Maximum
150.0 9.0 25.0 32.5 34.0 --
Unit
mA mA A dB dB %
current(3)
G Gp PAED
24.0 23.0 30.0
ACP1 ACP2 ACP3
-- -- --
-26.0 -46.0 -50.0
dBc dBc dBc
DFo2 DFo3 -- -- Np VSWR S Ru
-- -- -- -- -- -- -- --
-35.0 -35.0 30.0 30.0 -133.0 2.3:1 -60.0 10:1
dBc dBc S S dBm/Hz -- dBc VSWR
TDMA MODE, Vcc = +3.5 V, Vref = +3.1 V, Freq = 1850 - 1910 MHz, Tc = -30 C to +85 C. With NADC modulation applied. (3) Tc = +25 C.
4
Skyworks
100409F February 7, 2002
RM807
Power Amplifier Module for TDMA PCS (1850-1910 MHz)
Characterization Data
Characterization Data
The following charts illustrate the characteristics of a typical RM807 Power Amplifier tested in the evaluation board described in the following section. The amplifier was selected by characterizing a group of devices and choosing a part with average electrical performance at both nominal and worst case conditions. Figures 1 through 5 illustrate the digital signal characteristics of the RM807.
Figure 1. Digital Gain vs. Output Power
Vref = 3.1V, Vcc = 3.5V 40 35 30 Gain (dB) 25 20 15 10 0 5 10 15 Output Pow er (dBm ) 20 25 30
1850 MHz@-30 C 1880 MHz@-30 C 1910 MHz@-30 C
100409F February 7, 2002
1850 MHz@+85 C 1880 MHz@+85 C 1910 MHz@+85 C
1850 MHz@+25 C 1880 MHz@+25 C 1910 MHz@+25 C
5
Skyworks
Characterization Data
RM807
Power Amplifier Module for TDMA PCS (1850-1910 MHz)
Figure 2. Digital Adjacent Channel Power vs. Output Power
0
Vref = 3.1V, Vcc = 3.5V
-10 ACPR1 (dBc)
-20
-30
-40
-50 0 5 10 15 Output Pow er (dBm ) 20 25 30
Figure 3. Digital Alternate Channel Power vs. Output Power
Vref = 3.1V, Vcc = 3.5V -30
-40 ACPR2 (dBc)
-50
-60
-70
-80 0 5 10 15 Output Pow er (dBm ) 20 25 30
1850 MHz@-30 C 1880 MHz@-30 C 1910 MHz@-30 C
1850 MHz@+85 C 1880 MHz@+85 C 1910 MHz@+85 C
1850 MHz@+25 C 1880 MHz@+25 C 1910 MHz@+25 C
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100409F February 7, 2002
RM807
Power Amplifier Module for TDMA PCS (1850-1910 MHz)
Figure 4. Digital Power Added Efficiency vs. Output Power
Characterization Data
Vref = 3.1V, Vcc = 3.5V 50
40
DPAE (%)
30
20
10
0 0 5 10 15 Output Pow er (dBm ) 20 25 30
Figure 5. Analog Second Order Harmonic Suppression vs. Output Power
Vref = 3.1V, Vcc = 3.5V 0 -10 -20 DFo2 (dBc) -30 -40 -50 -60 0 5 10 15 Output Pow er (dBm ) 20 25 30
1850 MHz@-30 C 1880 MHz@-30 C 1910 MHz@-30 C
1850 MHz@+85 C 1880 MHz@+85 C 1910 MHz@+85 C
1850 MHz@+25 C 1880 MHz@+25 C 1910 MHz@+25 C
100409F February 7, 2002
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7
Evaluation Board Description
RM807
Power Amplifier Module for TDMA PCS (1850-1910 MHz)
Evaluation Board Description
The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the RM807, the evaluation board schematic and diagrams are included for preliminary analysis and design. Figure 6 shows the basic schematic of the board for the 1850 MHz to 1910 MHz range. Figure 7 illustrates the board layout.
Figure 6. Evaluation Board Schematic
VCC
C5 10,000 pF
50 9 Transmission Line RFIN C1 18 pF
50 9 Transmission Line (40 mils)
VCC 1 RM807 RFIN 2 3 VREF
GND 6
50 9 Transmission Line RFOUT
RFOUT 5 4 VCC2
C3 1,000 pF
C2 4.7 F
C4 1,000 pF
VREF VCC
NOTE: Both Vcc may be tied together at the supply.
100409_003
Figure 7. Evaluation Board Diagram
C5
J1
C1
RF IN
C2 C3 C4
J2
RF OUT
SKYWORKS J3
REF DESIGNATIONS VALUES C1 18 pF 4.7 F C2 C3 1,000 pF C4 1,000 pF 10,000 pF C5 QTY 1 1 1 1 1 100409_004
GND
8
Skyworks
GND
Vref
Vcc
100409F February 7, 2002
RM807
Power Amplifier Module for TDMA PCS (1850-1910 MHz)
Package Dimensions and Pin Description
Package Dimensions and Pin Description
The RM807 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board.
Figure 8. RM807 Package Drawing
2.870 (2x) 1.981 (2x) PIN 1 INDICATOR 1 6 2.500 (4x) 2 5 5.92/6.15 2 5 1.219 (2x)
6 (PIN 7)
3
4
3
4
.762 6x
- TOP VIEWS 5.92/6.15
R .500 TYP
NOTE: Solder mask pattern pad layout as seen from top looking through package.
1.500 TYP
All dimensions in millimeters.
FRONT VIEW
100409_002
Table 5. Pin Description Pin #
1 2 3 4 5 6 (7) GND PAD
NOTE(S):
(1) (2)
Function
VCC1(1) RF Input VREF VCC2(1) RF Output GND GND(2)
All supply pins may be connected together at the supply. Package underside is GND.
100409F February 7, 2002
Skyworks
9
Package and Handling Information
RM807
Power Amplifier Module for TDMA PCS (1850-1910 MHz)
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The RM807 is capable of withstanding an MSL 3/225 C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 C per second; maximum temperature should not exceed 225 C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 225 C for more than 10 seconds. For details on both attachment techniques, precautions, and handling procedures recommended by Conexant, please refer to Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020A. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Application Note: Tape and Reel, Document Number 101568.
Figure 9. Typical Case Markings
SKYWORKS
Mark Pin 1 Identifier
RM807-NN NXXXXX.XX YYWW MEX
Manufacturing Part Number-Revision Number Lot Number YY = Manufacture Year WW = Week Package Sealed MEX = Country Code
100409_006
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Skyworks
100409F February 7, 2002
RM807
Power Amplifier Module for TDMA PCS (1850-1910 MHz)
Electrostatic Discharge Sensitivity
Electrostatic Discharge Sensitivity
The RM807 is a Class I device. Figure 10 lists the Electrostatic Discharge (ESD) immunity level for each pin of the RM807 product. The numbers in Figure 10 specify the ESD threshold level for each pin where the I-V curve between the pin and ground starts to show degradation. The ESD testing was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body Model. Since 2000 volts represents the maximum measurement limit of the test equipment used, pins marked > 2000 V pass 2000V ESD stress.
Figure 10. ESD Sensitivity Areas
> +2000 V < -2000 V
VCC1
1
6
GND
> +2000 V < -2000 V
RFIN
2
5
RFOUT
> +2000 V < -2000 V
> +2000 V VREF < -2000 V
3
4
VCC2
> +2000 V < -2000 V
100409_008
Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards which fail devices only after "the pin fails the electrical specification limits" or "the pin becomes completely non-functional". Skyworks employs most stringent criteria, fails devices as soon as the pin begins to show any degradation on a curve tracer. To avoid ESD damage, latent and visible, it is very important that the product assembly and test areas follow the Class-1 ESD handling precautions listed in Table 6.
Table 6. Precautions for GaAs ICs with ESD Thresholds Greater Than 200V But Less Than 2000V
Personnel Grounding Wrist Straps Conductive Smocks, Gloves and Finger Cots Antistatic ID Badges Protective Workstation Dissipative Table Tops Protective Test Equipment (Properly Grounded) Grounded Tip Soldering Irons Conductive Solder Suckers Static Sensors Facility Relative Humidity Control and Air Ionizers Dissipative Floors (less than 109 to GND) Protective Packaging & Transportation Bags and Pouches (Faraday Shield) Protective Tote Boxes (Conductive Static Shielding) Protective Trays Grounded Carts Protective Work Order Holders
100409F February 7, 2002
Skyworks
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Electrostatic Discharge Sensitivity
RM807
Power Amplifier Module for TDMA PCS (1850-1910 MHz)
12
Skyworks
100409F February 7, 2002
Ordering Information
Model Number RM807 Manufacturing Part Number RM807-15 Product Revision 15 Package 6x6LM-6 Operating Temperature -30 C to +85 C
Revision History
Revision A B C D Level Date March 2000 March 2000 March 2001 April 2001 Initial Release Amend Title, Added Package Drawing Add Soldering and Temperature Change Guidelines, Evaluation Board information, Case Marking drawing, ESD data Revise: Manufacturing Part Number; Figure 3; ESD Data Add: Table 4; Figures 1 through 5, Packaging and Handling Information Section Revise: Add footnote to Table 1 Revise: Table 1 footnote 2. Description
E F
September 2001 February 7, 2002
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752 Application Note: Tape and Reel, Document Number 101568 JEDEC Standard J-STD-020A
(c) 2002, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF SKYWORKSTM PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS. SkyworksTM products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks' customers using or selling SkyworksTM products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: SkyworksTM, the Skyworks symbol, and "Breakthrough Simplicity"TM. Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Thirdparty brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.
General Information: Skyworks Solutions, Inc. 4311 Jamboree Rd. Newport Beach, CA. 92660-3007 www.skyworksinc.com

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